Delivering high value atmospheric plasma based solutions

OVERVIEW

IntrFace Technologies’ mission is to provide advanced materials interface solutions using non contact in-line atmospheric plasma treatment technology for bonding, coating, cleaning and sterilization applications.

Our market expertise includes the semiconductor, aerospace, composite, medical device and electronics industries.

Our team has vast experience delivering high value atmospheric plasma based solutions used to clean, functionalize and activate substrates used in UAV, drone, catheter, guide wire, semiconductor & electronics encapsulation, touch screen, OLED, mems, PCR plates, microfluidics, lab on chip and other applications.

OBJECTIVE

Our objective is to deliver high value atmospheric plasma based solutions that are safe, repeatable and reliable non-contact surface preparation systems. We help our customers deliver the highest quality products & components, replace expensive vacuum plasma & toxic wet chemical surface preparation methods or achieve significant cost reductions by eliminating primer and tie layers in adhesive, coating & print systems.

STRATEGY

Talk is cheap! We can talk plasma physics and academia but would rather solve your real world cleaning, sterilization, bonding, coating and printing challenges on-site at your facility as quickly as possible so you can get back to business. We have a fleet of demo and rental systems. Delivering high value atmospheric plasma based solutions enabling continuous-flow manufacturing processes is one of our key targets. We bring our systems to you solving problems fast and install in just a few minutes working to solve your application challenges right away. Our on-site real-time feasibility and applications support model allows you to run your post process shortly after plasma treatment without plasma treatment aging issues. You’ll get quality surface energy data on your actual samples and quick feedback on your post process performance after plasma treatment. This aggressive approach significantly shortens your feasibility and process development cycle.

Problem solving… fast